High-performance OCP 3.0 quad-port 25G NIC with Intel E810 chipset for data centers.
LR-LINK presents the LRES3027PF-OCP, a high-performance quad-port 25G Ethernet network adapter independently developed by Linkreal Electronics Co., Ltd. Based on the robust Intel® E810 controller, this adapter supports high-speed optical transmission and fully complies with the OCP 3.0 specification. Its compact small form factor (SFF) design makes it ideal for high-density datacenter deployments where space efficiency is critical.
Utilizing a PCIe Gen4 x16 interface, the LRES3027PF-OCP delivers high bandwidth and low latency, making it perfect for next-generation data centers and cloud infrastructure. It supports hot-swapping and is compatible with a wide range of 25G and 10G optical transceivers, DACs, and AOC cables, ensuring flexibility in connectivity options for various network topologies.
This adapter supports advanced networking features including SR-IOV, RDMA (iWARP/RoCEv2), VXLAN/NVGRE offloading, and Data Center Bridging (DCB). These capabilities significantly enhance performance in virtualized, distributed, and AI/HPC environments. Built for reliability, it includes features like NCSI, SMBus temperature monitoring, ScanChain, and Jumbo frames support up to 9.2KB.
Powered by Intel E810 for 25G speeds and low latency in data centers.
Fully compliant with OCP 3.0 specification for standard integration.
Four SFP28 ports supporting 25G/10G/1Gbps connections.
Supports SR-IOV and RDMA for optimized virtualized environments.
Small form factor SFF design ideal for high-density servers.
High-quality optical modules and cables for optimal compatibility with your network adapter.
Complete technical details for integration and deployment planning.
| Host Connector | PCIe 4.0 x16 |
|---|---|
| Connectors | SFP28 |
| Port | Quad |
| Link Speed | 25/10/1 Gbps |
| Supported Physical Layer Interfaces | DACs: 25GBASE-CR SFP+ 10GbE DAC; Optics and AOCs: 25GBASE-SR/LR, 10GBASE-SR/LR |
| Controller | Intel E810 |
|---|---|
| Adapter Type | OCP 3.0 |
| Form Factor | SFF |
| RDMA | |
|---|---|
| SR-IOV | Yes |
| NCSI | Yes |
| Jumbo Frames | 9.2 KB |
| Hot Swap | Yes |
| PXE/UEFI | Yes |
| WoL | Yes |
| 1588 PTP | Yes |
| ScanChain | Yes |
| FRU | Yes |
| PCB Size | 115 * 76 mm |
|---|---|
| Package Size | 179 * 150 * 30 mm |
| Operating Temperature | -10°C to 60°C |
|---|---|
| Storage Temperature | -40°C to 70°C |
| Storage Humidity | Maximum: 90% non-condensing relative humidity at 35°C |
| Certification | FCC, CE, RoHS |
|---|
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